Method for manufacturing a field plate in a trench of a...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

Reexamination Certificate

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Details

C438S270000, C438S454000, C438S589000, C257SE21410, C257SE21547

Reexamination Certificate

active

08062954

ABSTRACT:
A method for manufacturing a field plate in a trench of a power transistor in a substrate of a first conductivity type is disclosed. The trench is formed in a first main surface of the substrate.

REFERENCES:
patent: 4255207 (1981-03-01), Nicolay et al.
patent: 4635090 (1987-01-01), Tamaki et al.
patent: 5082795 (1992-01-01), Temple
patent: 5283201 (1994-02-01), Tsang et al.
patent: 5973360 (1999-10-01), Tihanyi
patent: 6406975 (2002-06-01), Lim et al.
patent: 7005351 (2006-02-01), Henninger et al.
patent: 7303961 (2007-12-01), Weber et al.
patent: 102 34 996 (2008-01-01), None

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