Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate
2007-07-17
2009-12-15
Monbleau, Davienne (Department: 2893)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Having light transmissive window
C257SE33001, C313S504000
Reexamination Certificate
active
07632714
ABSTRACT:
There is provided a method for manufacturing a display device. The method includes the steps of: forming a bottom electrode for supplying a first charge, in individual pixels on a substrate; forming a pattern of a first light-emitting layer having a first-charge transport property above the bottom electrode in part of the pixels; subjecting the substrate having the first light-emitting layer formed thereon to heat treatment; forming a pattern of a second light-emitting layer having a second-charge transport property on the heat-treated surface above the bottom electrode in the other pixels; and forming a top electrode for supplying a second charge so that the first light-emitting layer and the second light-emitting layer are sandwiched between the bottom electrode and the top electrode.
REFERENCES:
patent: 2006/0138945 (2006-06-01), Wolk et al.
patent: 2002-110350 (2002-04-01), None
patent: 2003-229259 (2003-08-01), None
patent: 2006-066375 (2006-03-01), None
Kagami Keiichi
Matsuda Eisuke
Monbleau Davienne
Mulcare Shweta
Sonnenschein Nath & Rosenthal LLP
Sony Corporation
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