Metal working – Method of mechanical manufacture – Electrical device making
Patent
1999-02-23
2000-12-19
Young, Lee
Metal working
Method of mechanical manufacture
Electrical device making
174 151, H05K 330
Patent
active
061612804
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a device for dissipating thermal energy produced by electronic components embedded in a printed circuit card, as well as the thermal dissipation device obtained by such method.
One particularity of electronic components is that their operation causes them to over-heat, and the resulting increase in temperature tends to affect the operating reliability of such components. It is thus necessary for such thermal energy to be dissipated, but the ever-increasing density of electronic components embedded in a card in no way facilitates this thermal dissipation.
Generally speaking, the cooling of electronic components embedded in a card is provided either by convection, or by conduction.
DESCRIPTION OF THE RELATED ART
Convection cooling is obtained by the circulation of a fluid that is usually forced outside air ventilation. This solution, although efficient, requires the installation of at least one, often bulky, ventilator. Moreover, this solution is not suited to equipment that has to remain sealed-off from the external environment.
Conduction cooling consists in providing a thermal drain to evacuate the calories towards the exterior. By way of example, and as described in document FR-A-2,654,890, the thermal drain is formed of a rigid metallic plate. This plate is mounted in parallel to the card and is thermally connected to the electronic components by an element or interposed layer of a thermally conductive and electrically insulating material that is in contact firstly with the electronic components, and secondly with the metallic plate. This plate is then fastened by means of a thermal connector to a cold wall that is, more often than not, the metallic chassis whose purpose is also to hold the card.
Such a thermal dissipation device is difficult to implement, notably with regard to the contacting of the rigid metallic plate and the interposed layer, given the presence of the thermal connector that must be fastened, as must the card, to the chassis of the equipment. In such circumstances, the width of the contact surface between the interposed layer and the metallic plate will notably depend on the manufacturing accuracy of the fastening means for the card and thermal connector.
The U.S. Pat. No. 5,403,973 describes a process to close tightly under vacuum a device to protect a printed circuit card, in which the said card is introduced in a casing of plastic material, this casing being provided with a upper face adjacent to the upper face of the card and a lower face adjacent to the lower face of the card, to introduce a metallic sheet between at least one of these said upper and lower faces of the said casing and the opposite face of the card, to introduce a layer of electrically conductive material between the metallic sheet and the opposite face of the card, and to close tightly under vacuum the said casing, the metallic sheet being a dissipation device for the heat produced by the components.
BRIEF SUMMARY OF THE INVENTION
The aim of the invention is to produce a thermal dissipation device by conduction that is both simple to implement and does not require manufacturing tolerances that are as restrictive as those required by prior art.
To this end, the invention proposes a method for manufacturing a device to dissipate the thermal energy produced by electronic components embedded in a printed circuit card, such method consisting in depositing on the card a first layer of a first thermally conductive and electrically insulating material to cover at least the connecting tabs for said electronic components to be cooled, and putting this said first layer in contact with a metallic drain connected to a thermal mass to drain the calories towards the exterior of said card, wherein the method consisting in making said drain in the form of a flexible porous structure, and in depositing on said drain a second layer of a second material that adheres to said first layer through the pores of said drain to hold the latter in plac
REFERENCES:
patent: 4974119 (1990-11-01), Martin
patent: 5095626 (1992-03-01), Kitamura et al.
patent: 5403973 (1995-04-01), Santilli et al.
patent: 5738907 (1998-04-01), Vaccaro et al.
Dessaux Christophe
Moreau Emmanuel
Giat Industries
Smith Sean
Young Lee
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