Method for manufacturing a composite arrangement

Details Method for manufacturing a composite arrangement Method for manufacturing a composite arrangement

1997-02-21

1999-07-20

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563073, 1563077, 1563096, 156 87, 156276, 156290, 156295, 156537, H05K 300

Patent

active

059252103

ABSTRACT:
In a method for manufacturing a composite arrangement, at least one printed circuit board substrate is joined with a support under the influence of an applied pressure exerted by a press die over a weave layer (prepreg) impregnated with resin, such that the resin in the region of an opening of the printed circuit board substrate does not flow into this opening. The applied pressure is, therefore, at least partially reduced in the region of the opening of the printed circuit board substrate.

REFERENCES:
patent: 2495761 (1950-01-01), Platt
patent: 3158927 (1964-12-01), Saunders

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