Method for manufacturing a component, in particular a...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Thermally responsive

Reexamination Certificate

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C438S071000, C257S467000

Reexamination Certificate

active

06933166

ABSTRACT:
A method of manufacturing a component, in particular a thermal sensor, and a thermal sensor. The component has at least two regions having different heat conductivities, a surface region being created in a substrate and the heat conductivity of the surface region being lower than that of the surrounding substrate. For producing a flat topography on the component a layer is created which covers the surface region. The layer and the surface region have at least approximately similar physical properties.

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patent: 0789236 (1997-08-01), None
patent: 04125929 (1992-04-01), None

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