Method for manufacturing a coaxial interconnect

Details Method for manufacturing a coaxial interconnect Method for manufacturing a coaxial interconnect

1995-05-26

1996-12-24

Yeung, George

Plastic and nonmetallic article shaping or treating: processes

Forming electrical articles by shaping electroconductive...

264265, C04B 3500

Patent

active

055871194

ABSTRACT:
A multi-chip-module comprising a plurality of vertically layered substrates and including a plurality of coaxial inter-connects formed between and through the substrate layers. Each of the coaxial inter-connects is formed by a process wherein: an outer hole (aperture) is drilled through the substrate and lined with an electrically conductive material to form an outer via; the outer via is filled with a dielectric material; and, an inner hole (aperture) is drilled through the dielectric material and filled with an electrically conductive material to form a center via. The characteristic impedance of the coaxial inter-connect is determined by the selection of the outer diameters of the drilled holes for the outer and center vias.

REFERENCES:
patent: 4911771 (1990-03-01), Tanaka et al.
patent: 5518674 (1996-05-01), Powell et al.

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