Method for manufacturing a ceramic multilayer substrate for comp

Details Method for manufacturing a ceramic multilayer substrate for comp Method for manufacturing a ceramic multilayer substrate for comp

1997-02-26

1999-03-02

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 8914, 156 8917, 156 8919, 156 8921, 29 2542, 3613211, 361762, 361763, B32B 3126, H01G 412, H01G 4224

Patent

active

058765387

ABSTRACT:
Ceramic multilayer substrates as circuit supports for complex electronic circuits wth integrated capacitors are manufactured by printing capacitor structures, using the screen printing process, directly onto a first green ceramic film. The first green ceramic film with the printed structures is arranged in a stack with further green ceramic films, laminated, and fired. During lamination of the ceramic films, the printed structures are pressed into the ceramic films so that after firing, a multilayer substrate with integrated capacitors results.

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patent: 5661882 (1997-09-01), Alexander
patent: 5708570 (1998-01-01), Polinsk, Sr.

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