Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-04-04
2006-04-04
Chang, Richard (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C174S254000, C174S256000, C427S097100, C427S099300
Reexamination Certificate
active
07020961
ABSTRACT:
An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask (7) is formed on the bump formation side (3a) of a metal foil (3) having a thickness (t1+t2) equal to the sum of the thickness t1of a wiring circuit (1) and the height t2of the bumps (2) to be formed on a wiring circuit (1), the bumps (2) are formed by half-etching the metal foil (3) from the bump formation etching mask (7) side down to a depth corresponding to a predetermined bump height t2,and a metal thin film layer (10) composed of a different metal from the metal foil (3) is formed on the bump formation side of the metal foil (3), thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.
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Kaneda Yutaka
Kishimoto Soichiro
Naito Keiichi
Shinohara Toshihiro
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