Method for manufacturing a bump-attached wiring circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S846000, C174S254000, C174S256000, C427S097100, C427S099300

Reexamination Certificate

active

07020961

ABSTRACT:
An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask (7) is formed on the bump formation side (3a) of a metal foil (3) having a thickness (t1+t2) equal to the sum of the thickness t1of a wiring circuit (1) and the height t2of the bumps (2) to be formed on a wiring circuit (1), the bumps (2) are formed by half-etching the metal foil (3) from the bump formation etching mask (7) side down to a depth corresponding to a predetermined bump height t2,and a metal thin film layer (10) composed of a different metal from the metal foil (3) is formed on the bump formation side of the metal foil (3), thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

REFERENCES:
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4774127 (1988-09-01), Reagan et al.
patent: 4908940 (1990-03-01), Amano et al.
patent: 4931144 (1990-06-01), Brighton
patent: 5252988 (1993-10-01), Katayama et al.
patent: 5260518 (1993-11-01), Tanaka et al.
patent: 5329423 (1994-07-01), Scholz
patent: 6181569 (2001-01-01), Chakravorty
patent: 6562250 (2003-05-01), Kaneda et al.
patent: 6568073 (2003-05-01), Fukutomi et al.
patent: B-57-18357 (1982-04-01), None
patent: A-05-183266 (1993-07-01), None
patent: A-10-256736 (1998-09-01), None
patent: A-11-054568 (1999-02-01), None
patent: 2000-082761 (2000-03-01), None
patent: A-2000-082761 (2000-03-01), None
patent: 2000-165037 (2000-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing a bump-attached wiring circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a bump-attached wiring circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a bump-attached wiring circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3525294

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.