Method for manufacturing a Bi-CMOS device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 34, 437 56, 437 70, 437 41, 437 11, 437 45, 437911, 357 43, 357 91, H01L 21265

Patent

active

048681350

ABSTRACT:
A method for fabricating a Bi-CMOS device is disclosed herein, which device can include both vertical PNP and NPN components. The process steps include forming the reach-through N+ subcollector to the bipolar device without extra processing steps; combining into one mask the threshold adjust/well implants with self-aligned isolation leakage protection implants by using a self-aligned, removable oxide mask prior to field isolation; using a resist etch-back scheme to protect against emitter-to-base punch-through while self-aligning the pedestal and base; and also providing for the removal of the gate oxide at the emitter while maintaining it at the FET, without extra masks.
The device incorporates similar structural featues between the bi-polar and FET devices. The NPN and pFET can share the same well and a P+ diffusion (the p+ extrinsic base is the same as the p+ source). Also, the pnp and nFET can share the same well and an n+ diffusion.

REFERENCES:
patent: 4403395 (1983-09-01), Curran
patent: 4553315 (1985-11-01), McCarty
patent: 4696092 (1987-09-01), Doering et al.
patent: 4778774 (1988-10-01), Blossfeld
patent: 4784966 (1988-11-01), Chen
patent: 4818719 (1989-04-01), Yeh et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing a Bi-CMOS device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a Bi-CMOS device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a Bi-CMOS device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-368552

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.