Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2011-07-05
2011-07-05
Talbot, Brian K (Department: 1715)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S097700, C427S098400, C427S117000
Reexamination Certificate
active
07972650
ABSTRACT:
A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.
REFERENCES:
patent: 5141602 (1992-08-01), Chen et al.
patent: 5631191 (1997-05-01), Durand et al.
patent: 5675180 (1997-10-01), Pedersen et al.
patent: 6588097 (2003-07-01), Nishide et al.
patent: 2005/0266154 (2005-12-01), Devos et al.
Val, Christian and Lemoine, Thierry, “3-D Interconnection for Ultra-Dense Multichip Modules,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Dec. 1990, vol. 13, No. 4, Institute of Electrical and Electronics Engineers, Inc. (Las Vegas, Nevada, US).
Church Kenneth H.
Clark Patrick
Irwin Bryan
Pelekhaty Vladimir
Swan Lance
McKee Voorhees & Sease, P.L.C.
nScrypt, Inc.
Talbot Brian K
LandOfFree
Method for manufacturing 3D circuits from bare die or... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing 3D circuits from bare die or..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing 3D circuits from bare die or... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2701750