Etching a substrate: processes – Forming or treating electrical conductor article – Adhesive or autogenous bonding of self-sustaining preforms
Patent
1994-10-31
1997-03-11
Dang, Thi
Etching a substrate: processes
Forming or treating electrical conductor article
Adhesive or autogenous bonding of self-sustaining preforms
216 18, 216 16, 216 95, 216100, H05K 300
Patent
active
056097735
ABSTRACT:
In a multilayer wiring board comprising a substrate on which two or more layers of wiring or insulation film are formed of different materials, for example, the wiring layer is processed so that the processed side faces of the board contour a stepped shape in the cross-sectional view of the board, whereby coverage of a film formed thereon can be improved. Specifically, first, insulation film 2 is formed on a substrate 1 and then, resistor film 3 and resistor electrode film 4 are continuously formed thereon to form a film of multiple structure. Mask 9 is formed thereon. Then, the layers is etched successively in the order of from the top layer and thereafter only the resistor electrode film 4 is further etched with an etching solution which selectively etches only the resistor electrode film 4 to form a stepwise patterned side face. Finally, the mask is removed and wiring electrode film 5 is formed.
REFERENCES:
patent: 4226932 (1980-10-01), Ferraris
patent: 4451554 (1984-05-01), Kishi et al.
patent: 5192716 (1993-03-01), Jacobs
patent: 5227012 (1993-07-01), Brandli et al.
patent: 5256247 (1993-10-01), Watanabe et al.
Usui Mitsuru
Watanabe Tetsuya
Dang Thi
Hitachi , Ltd.
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