Method for manufacture of an integrated MOS semiconductor array

Fishing – trapping – and vermin destroying

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437 48, 437238, 437241, 427 96, H01L 2131

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050949837

ABSTRACT:
A method of manufacture of an integrated MOS semiconductor array for the low-frequency range having MOS components and circuit paths arranged on a semiconductor substrate. Exposed surfaces between the circuit paths are made hydrophobic by germinating with hexamethyl disilazane ((CH.sub.3).sub.3 SiNHSi(CH.sub.3).sub.3), so that the occurrence of leakage currents is avoided. In addition, in an integrated MOS semiconductor array in which the MOS components and the circuit path are covered with a protective layer, the surface of this protective layer is made hydrophobic. As a result, both leakage currents and parasitic capacitances are prevented.

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IBM Technical Disclosure Bulletin, vol. 26, No. 2, Jul. 1983.
T. Wada, et al., "The Influence of Passivation Layer on Aluminum Corrosion on Simulated Microelectronics Circuit Pattern", Solid State Science and Technology, Mar. 1989, pp. 732-735.
Dean Freeman et al., "Properties of Low-Pressure Chemical Vapor Deposited Dielectric Films from Hexamethyl-Disilazane", J. Vac. Technol. A7(3), May/Jun., pp. 1446-14507.
German Search Report, 5/15/90.

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