Method for manufacture of a semiconductor device

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29578, 357 59, B01J 1700

Patent

active

041142543

ABSTRACT:
A semiconductor device and method of making the same is disclosed having a surface passivation film of a polycrystalline silicon layer containing 2 to 45 atomic percent of oxygen atoms.
The polycrystalline silicon layer is locally electrically insulated by oxidizing throughout the thickness of the layer.
The local oxidizing treatment causes the polycrystalline or silicon layer to pattern.

REFERENCES:
patent: 4001873 (1977-01-01), Kajiwara
IBM Technical Disclosure Bulletin, "Doped Polycystalline Field Shield Process," Abbas et al., p. 1981, vol. 15, No. 6, Nov. 1972.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacture of a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacture of a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacture of a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2111290

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.