Method for making tungsten-titanium sputtering targets and produ

Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions

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204292, 419 10, 419 48, 419 54, 419 60, C22C 2900

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048389358

ABSTRACT:
Tungsten-titanium sputtering targets with improved characteristics are made from high-purity tungsten powder and a second powder consisting of high-purity titanium hydride powder or high-purity titanium hydride powder and high-purity titanium powder. The second powder contains at least 5%, preferably 25% to 100% by weight of titanium hydride powder. A powder mixture having a binodal particle size distribution with respect to the tungsten and second powders is placed under a containment pressure in a die. The die is heated in a vacuum hot-press chamber to a temperature sufficient to dehydride the titanium hydride, and to remove gases and alkali metals. The die is then heated to a second temperature in the range of 1350.degree. to 1550.degree. C. while maintaining the containment pressure and vacuum. A compaction force in the range of 2000 to 5000 psi is then applied to form a compact. The compaction force and vacuum are subsequently released and the compact is cooled. The compact is easily machined to give a sputtering target having a density of at least 95%, preferably, at least 100% of theoretical density, a total gas content of less than 850 ppm, a carbon content of less than 100 ppm and low particulates upon sputtering.

REFERENCES:
patent: 4331476 (1982-05-01), Helderman et al.
patent: 4619695 (1986-10-01), Oikawa et al.
patent: 4663120 (1987-05-01), Parent et al.
patent: 4731116 (1988-03-01), Kay
patent: 4750932 (1988-06-01), Parent et al.
patent: 4770948 (1988-09-01), Oikawa et al.

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