Metal fusion bonding – Process – With shaping
Patent
1991-04-05
1992-06-02
Seidel, Richard K.
Metal fusion bonding
Process
With shaping
228 443, 228193, 22826321, B23K 3102
Patent
active
051180260
ABSTRACT:
A method for fabricating of intermetallic titanium aluminide sandwich structures in which blanks of titanium aluminide are bonded to one another, under vacuum in a retort, at selected areas to form a pack, and then, upon removal of the retort, expanded superplastically to form a desired sandwich structure. Bonding of the various preselected areas of the metal blanks is accomplished using elevated temperature gas diffusion bonding techniques. The invention contemplates a first thermal cycle during which the pack is diffusion bonded in an evacuated retort at one temperature within a predetermined range of temperatures, and a second thermal cycle during which subsequent superplastic forming of the pack of bonded blanks, with the retort removed, is carried out. Optionally, during the first thermal cycle, a step of superplastic preforming may be carried out whereby the pack is preformed against arcuate or other shaped forming members.
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Lewis Terrell P.
Mah Chuck Y.
Rockwell International Corporation
Seidel Richard K.
Silberberg Charles T.
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