Method for making thin layers containing microcomponents

Details Method for making thin layers containing microcomponents Method for making thin layers containing microcomponents

2002-10-08

2009-11-10

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C257SE21568

Reexamination Certificate

active

07615463

ABSTRACT:
The invention concerns a method for making thin layers containing microcomponents using a substrate. The method includes the following steps: a) provides a substrate; b) local implantation of at least a gaseous species in said substrate perpendicular to a plurality of implantation zones defined on the surface of the substrate, avoiding, by adequate selection of the depth and the shape of said implantation zones, degradation of said surface of the substrate during the step c); c) producing microcomponents in the surface layer of the substrate delimited by the implanting depth; and d) separating the substrate in two parts, one part containing the surface layer including said microcomponents, and the other the rest of the substrate. The invention is useful for producing microcomponents to be integrate on supports different from the those used for their manufacture.

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