Method for making thin film devices intended for solar cells...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates

Reexamination Certificate

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C438S458000

Reexamination Certificate

active

07022585

ABSTRACT:
In one inventive aspect, a thin film device is manufactured by (a) forming a porous semiconductor layer in the form of a thin film on an original substrate, the formation being immediately followed by (b) separation of the thin film by a lift-off process from the original substrate; (c) transfer of the thin film to a dummy support, the thin film not being attached to the dummy support; (d) fabrication of a device on top of the thin film; and (e) transfer and attachment of said device on said thin film on a foreign substrate.

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S. M. Sze: “Semiconductor Devies Physics and Technology” 1985, John Wiley and Sons, Murray Hill, New Jersey, USA, XP002311145 ISBN: 0-471-87424-8 *p. 441-442 *figure 11.

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