Method for making thick film circuit housing assembly design

Details Method for making thick film circuit housing assembly design Method for making thick film circuit housing assembly design

1990-11-19

1991-09-17

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

295921, 338 42, H05K 339

Patent

active

050481819

ABSTRACT:
A housing and a pressure seal structure for use with a thick film circuit having a pressure sensor and terminals includes a base plate below the thick film circuit, a top housing above the thick film circuit covering the pressure sensor and an intermediate rubber ring between the housing and the thick film circuit. A coupling force is applied between the base plate and the top housing to draw the two together and apply a sealing force to the rubber ring and establish a pressure seal at the rubber ring.

REFERENCES:
patent: 3899766 (1975-08-01), Mermelstein
patent: 3935632 (1976-02-01), Mermelstein
patent: 4021766 (1977-05-01), Aine
patent: 4371762 (1983-02-01), Diamond
patent: 4656454 (1987-04-01), Rosenberger
patent: 4850227 (1989-07-01), Luettgen et al.
patent: 4994781 (1991-02-01), Sahagen

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