Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2000-02-10
2001-10-09
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S842000, C029S845000, C029S846000
Reexamination Certificate
active
06298552
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to a socket connector for connecting a central processing unit (CPU) module to a circuit board, and in particular to a method for making a low profile socket connector.
2. The Prior Art
Socket connectors for retaining and electrically connecting a CPU module to a circuit board are well known in the art. A socket connector comprises a flat housing defining an array of holes therein for receiving and retaining conductive contacts. The flat housing is positioned on a circuit board and retains a CPU module thereon with the contacts electrically engaging corresponding conductors of the CPU module and the circuit board to establish electrical connection therebetween.
The socket connector requires a predetermined total socket height in order to provide sufficient retention force for the contacts. The contacts so retained undergo elastic deformation when contacted by the corresponding conductors of the CPU module for establish electrical engagement therebetween. As the size of the socket connectors is reduced with the trend of miniaturization, the total socket height is reduced which results in insufficient retention force of the contacts.
Furthermore, the size of the contacts is also reduced leading to a severe problem of yielding when contacted by the corresponding conductor of the CPU module. Yielding of the contacts may cause poor electrical engagement between the contacts of the socket connector and the corresponding conductors of the CPU module.
In addition, the size-reduced contacts represent a problem of poor productability and high flaw rate and thus poor reliability for it is more difficult to make and assemble the contacts to the housing. The poor reliability may also cause problems in mounting the socket to a circuit board by a system integrator or a mother board manufacturer.
It is thus desired to provide a method for efficiently making socket connectors of high reliability and consistent quality for overcoming the problems discussed above.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a method for efficiently making low profile socket connectors.
Another object of the present invention is to provide a method for making socket connectors with low flaw rate.
A further object of the present invention is to provide a method for making socket connector wherein pitch between contacts of the socket connector may be modified easily.
Yet a further object of the present invention is to provide a method for making size-reduced socket connectors wherein yielding of small-sized contacts is prohibited.
A further object of the present invention is to provide a method for making socket connectors having contacts forming the shortest path between a CPU module retained by the socket connector and a circuit board supporting the socket connector.
To achieve the above objects, a method for making socket connectors in accordance with the present invention comprises the steps of (1) attaching a conductive film to a first face of an insulative plate to form a laminate, the insulative plate defining at least an array of bores therein; (2) photo-etching or laser-etching the conductive film to remove the conductive film with a portion thereof left in the laminate corresponding to each bore of the insulative plate, the portion of the conductive film having a base section attached to the first face of the insulative plate and a beam section extending from the base section over the corresponding bore; and (3) performing a second forming process to bend each beam section through the corresponding bore and partially extending over a second face of the insulative plate to be opposite the base section, the beam section being spaced from the second face of the insulative plate for resilient deformation in engaging a CPU module positioned on the second face of the insulative plate. A further step of attaching a solder ball to each base section may be selectively taken for surface mounting the socket connector to a circuit board.
REFERENCES:
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4950173 (1990-08-01), Minemura et al.
patent: 5632631 (1997-05-01), Fjelstad et al.
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5934914 (1999-08-01), Fjelstad et al.
patent: 6086386 (2000-07-01), Fjelstad et al.
Arbes Carl J.
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
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