Method for making semiconductor devices having electroplated lea

Details Method for making semiconductor devices having electroplated lea Method for making semiconductor devices having electroplated lea

1995-06-26

1996-06-25

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating electrolytic or nonelectrolytic coating after it is...

205225, 205123, C25D 550

Patent

active

055296823

ABSTRACT:
A method for use with semiconductor devices (47) that have leads (49) electroplated with a solderable metal (53) includes exposing the solderable metal (53) to an elevated temperature sufficient to flow or melt the solderable metal (53). In a preferred embodiment, the solderable metal (53) is exposed to the elevated temperature before the leads (49) are severed from the leadframe (48).

REFERENCES:
patent: 4012832 (1977-03-01), Crane
patent: 4894752 (1990-01-01), Murata et al.
patent: 5167794 (1992-12-01), Ito

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