Method for making printed circuit boards with selectivity filled

Metal working – Method of mechanical manufacture – Electrical device making

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174262, 174263, 174266, 427 97, H01K 310

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054872189

ABSTRACT:
Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.

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patent: 4211603 (1980-07-01), Reed
patent: 4287253 (1981-09-01), Leech
patent: 4479991 (1984-10-01), Thompson
patent: 4718972 (1988-01-01), Babu et al.
patent: 4994349 (1991-02-01), Blumenstock et al.
patent: 5116459 (1992-05-01), Kordus et al.
patent: 5232548 (1993-08-01), Ehrenberg et al.
patent: 5309632 (1994-05-01), Takahashi et al.
Research Disclosure, No. 25906 Nov. 1985; "A Printer Circuit Card With Filled Vias For Surface Mount Technology".

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