Method for making porous bottom-layer dielectric composite struc

Details Method for making porous bottom-layer dielectric composite struc Method for making porous bottom-layer dielectric composite struc

1986-07-23

1988-02-09

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

501 18, 501 20, 501138, 501139, B32B 1800, B32B 3126

Patent

active

047240210

ABSTRACT:
A method for inhibiting the formation of blisters during the firing of intermediate layers of fired multilayer electronic components comprising the sequential steps of:

REFERENCES:
patent: 3673092 (1972-06-01), Dietz
patent: 3788997 (1974-01-01), MacKenzie
patent: 3926702 (1975-12-01), Oki et al.
patent: 4010133 (1977-03-01), Nakayama
patent: 4055451 (1977-10-01), Cockbain et al.
patent: 4481261 (1984-11-01), Johnson et al.

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