Method for making patterned platinum metallization

Details Method for making patterned platinum metallization Method for making patterned platinum metallization

1976-01-23

1977-08-02

Kendall, Ralph S.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 43, 427 96, 427 99, 427 88, 427125, 427229, 204192R, 204192EC, 96 362, H05K 100

Patent

active

040396983

ABSTRACT:
A method is disclosed for making precisely patterned platinum films in the manufacture of integrated circuit devices. The method calls for the deposition of a film of a platinum compound, whose heat of formation is in the range of from -100 to +10 Kcal/mole, patterning the film, and thermally reducing the patterned film to platinum metal.

REFERENCES:
patent: 3117023 (1964-01-01), Tirrell
patent: 3451813 (1969-06-01), Kinney et al.
patent: 3630768 (1971-12-01), Bianchi et al.
patent: 3930963 (1976-01-01), Polichette et al.

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