Method for making patterned gold metallization

Details Method for making patterned gold metallization Method for making patterned gold metallization

1976-01-23

1978-02-07

Kendall, Ralph S.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 43, 427 53, 427 96, 427 99, 427125, 96 88, 204192C, 427259, H05K 100

Patent

active

040727688

ABSTRACT:
A method is disclosed for making patterned gold films in the manufacture of integrated circuit devices. The method calls for the deposition of a film of a gold compound whose heat of formation is in the range of from -20 to +10 Kcal/mole, selectively reducing the gold compound to elemental gold by irradiation, and chemically removing the unreduced portions of the gold compound.

REFERENCES:
patent: 3256109 (1966-06-01), Berger
patent: 3281264 (1966-10-01), Cape et al.
patent: 3529961 (1970-09-01), Schaefer et al.
patent: 3684569 (1972-08-01), Milgram
patent: 3762938 (1973-10-01), Ridenour et al.
patent: 3904783 (1975-09-01), Nara et al.
patent: 3930963 (1976-01-01), Polichette et al.
patent: 4009297 (1977-02-01), Redmond et al.

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