Method for making offset alignment marks

Details Method for making offset alignment marks Method for making offset alignment marks

1997-06-25

1999-08-24

Bowers, Charles

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

438462, H01L 2176

Patent

active

059435879

ABSTRACT:
Offset alignment marks and a method of forming offset alignment marks within a kerf region of a semiconductor wafer in the manufacture of semiconductor devices includes the steps of forming a first track of a kerf and forming a second track of the kerf. The first track includes at least one alignment mark region having a first alignment mark disposed therein for use in an alignment of a first field of a first semiconductor chip active area. The second track includes at least one alignment mark region having a second alignment mark disposed therein for use in an alignment of a second field of a second semiconductor chip active area. The alignment mark regions of the first track and the second track are complementary and interlocking alignment mark regions extending across a centerline of the kerf and arranged in an offset manner with respect to one another along the kerf.

REFERENCES:
patent: 4423959 (1984-01-01), Nakazawa et al.
patent: 5106432 (1992-04-01), Matsumoto et al.
patent: 5496777 (1996-03-01), Moriyama
patent: 5786114 (1997-01-01), Hashimoto

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