Method for making nano-scale lead-free solder

Details Method for making nano-scale lead-free solder Method for making nano-scale lead-free solder

2007-11-06

2007-11-06

Wyszomierski, George P. (Department: 1742)

Specialized metallurgical processes, compositions for use therei

Processes

Producing or purifying free metal powder or producing or...

C075S371000

Reexamination Certificate

active

10928203

ABSTRACT:
A method for making Nano-scale lead-free solder includes the following steps of: forming a mixture solution Sn-Ag or Sn-Ag-Cu; making NaBH4, NaOH and alkyl C12H25OSO3Na to a reducing dispersing solution; producing reactant Sn-Ag or Sn-Ag-Cu by means of the oxidation reduction method; and adding 95% ethanol to be mixed, and cleaning the reactant by using a supersonic vibrator for removing boron (B) and sulfur (S) atom which adhere to the reactant, thereby producing the Nano-scale (0.1˜100 nm) lead-free solder Sn-3.5Ag or Sn-3.5Ag-xCu (x=0.2˜1.0).

REFERENCES:
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Kim, J.Y. et al., “The Effects of Electroplating Parameters on the Composition and Morphology of Sn-Ag Solder”, Journal of Electronic Materials, vol. 33, No. 12, pp. 1459-1464, 2004.

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