Method for making multilayer printed circuit board having blind

Details Method for making multilayer printed circuit board having blind Method for making multilayer printed circuit board having blind

1994-06-02

1996-08-13

Forson, George E.

Etching a substrate: processes

Forming or treating electrical conductor article

216105, C23F 100

Patent

active

055447732

ABSTRACT:
Provided is a method for making a multilayer printed circuit board having blind holes which comprises heat laminating a copper foil and an inner layer panel previously provided with circuit patterns on one or both sides thereof by processing a copper-clad laminate, a resin layer soluble in an aqueous alkali solution and having a flowability upon heating being present between said copper foil and said inner layer panel, forming via holes in the surface copper foil by etching and then dissolving the resin layer under said via holes with an aqueous alkali solution and removing the resin layer, thereby to form blind holes in which the copper foil on the inner layer panel is exposed. Further provided is a copper foil used for making multilayer printed circuit boards, which is provided with a resin layer soluble in an aqueous alkali solution and having flowability upon heating on its roughened surface.

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Clyde F. Coombs, "Printed Circuits Handbook", 3rd Edition, 1988, pp. 11.1-11.37, 32.2.

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