Method for making multi-layer ceramic packages

Details Method for making multi-layer ceramic packages Method for making multi-layer ceramic packages

1994-09-02

1996-01-09

Beck, Shrive

Coating processes

Electrical product produced

427 96, 427125, 174 521, 29 2535, B05D 512

Patent

active

054827353

ABSTRACT:
A method for making multi-layer ceramic packages. The method provides for attaching contact pins to a ceramic substrate after the application of an intermediate metal layer and an outer metal layer. This eliminates plating the contact pins with an intermediate metal layer and an outer metal layer, thereby saving material and process time.

REFERENCES:
patent: 3634600 (1972-01-01), Griffin et al.
patent: 3941916 (1976-03-01), Morse
patent: 4137628 (1979-02-01), Suzuki
patent: 4465742 (1984-08-01), Nagashima et al.
patent: 4675243 (1987-06-01), Obinata et al.
patent: 5080980 (1992-01-01), Sakaguchi et al.

Affiliated with

Also associated with

Rating

Method for making multi-layer ceramic packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making multi-layer ceramic packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making multi-layer ceramic packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1301414