Method for making multi-layer ceramic acoustic transducer

Details Method for making multi-layer ceramic acoustic transducer Method for making multi-layer ceramic acoustic transducer

2006-03-28

2006-03-28

Dougherty, Thomas M. (Department: 2834)

Metal working

Piezoelectric device making

C310S311000, C310S328000, C310S334000

Reexamination Certificate

active

07017245

ABSTRACT:
A method for manufacturing a multi-layer acoustic transducer with reduced total electrical impedance. The method is based on the bonding of two piezoelectric ceramic layers with confronting metallized surfaces to a thin electrical conductor, then electrically connecting the top and bottom surfaces to form a wrap-around electrode while a center conductor forms a second electrode. The total electrical impedance of a two-layer ceramic stack comprised of piezoelectric layers connected in this manner is one-fourth that of a solid ceramic element of the same size. This provides for better matching of the acoustic stack impedance to that of the electrical cable, increased penetration depth for imaging within the body, and improved acoustic element sensitivity.

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Goldberg et al., “Multi-Layer PZT Transducer Arrays for Improved Sensitivity”, 1992 IEEE Ultrasonics Symposium, pp. 551-554.
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Desilets et al., “Effect of Wraparound Electroded on Ultrasonic Array Performance,” 1998 IEEE Ultrasonics Symposium (preprint).
Martin et al., “Back-Face Only Electrical Connections of Thickness Mode Piezoelectric Transducers,” IEEE Trans. UFFC, vol. 33, No. 6, 778-781 (1986).

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