Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2005-01-25
2005-01-25
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S050000
Reexamination Certificate
active
06846691
ABSTRACT:
A method and resulting formed device are disclosed wherein the method combines polysilicon surface-micromachining with metal electroplating technology to achieve a capacitively-driven, lateral micromechanical resonator with submicron electrode-to-resonator capacitor gaps. Briefly, surface-micromachining is used to achieve the structural material for a resonator, while conformal metal-plating is used to implement capacitive transducer electrodes. This technology makes possible a variety of new resonator configurations, including disk resonators and lateral clamped-clamped and free-free flexural resonators, all with significant frequency and Q advantages over vertical resonators. In addition, this technology introduces metal electrodes, which greatly reduces the series resistance in electrode interconnects, thus, minimizing Q-loading effects while increasing the power handling ability of micromechanical resonators.
REFERENCES:
patent: 5082242 (1992-01-01), Bonne et al.
patent: 5455547 (1995-10-01), Lin et al.
patent: 5491604 (1996-02-01), Nguyen et al.
patent: 5537083 (1996-07-01), Lin et al.
patent: 5589082 (1996-12-01), Lin et al.
patent: 5620931 (1997-04-01), Tsang et al.
patent: 5640133 (1997-06-01), MacDonald et al.
patent: 5839062 (1998-11-01), Nguyen et al.
patent: 5914553 (1999-06-01), Adams et al.
patent: 5955932 (1999-09-01), Nguyen et al.
patent: 6167757 (2001-01-01), Yazdi et al.
patent: 6204737 (2001-03-01), Ella
patent: 6236281 (2001-05-01), Nguyen et al.
patent: 6249073 (2001-06-01), Nguyen et al.
patent: 6265806 (2001-07-01), Suzuki
patent: 6305779 (2001-10-01), Capurso et al.
patent: 6316827 (2001-11-01), Asano et al.
patent: 6347237 (2002-02-01), Eden et al.
patent: 6393913 (2002-05-01), Dyck et al.
patent: 6429034 (2002-08-01), Pai et al.
patent: 6448622 (2002-09-01), Franke et al.
Hsu, Wan-Thai, et al., A Sub-Micron Capacitive Gap Process For Multiple-Metal-Electrode Lateral Micromechanical Resonators, Technical Digest, IEEE Int. Micro Electromechanical Systems Conf., Interlake , Switzerland, Jan. 21-25, 2001, pp. 349-352.
Hsu, Wan-Thai, et al., Mechanically Temperature-Compensated Flexural-Mode Micromechanical Resonators, Technical Digest, IEEE Int. Electron Devices Meeting, San Francisco, California, Dec. 11-13, 2000, pp. 399-402.
Clark, John R., et al., High-Q VHF Micromechanical Contour-Mode Disk Resonators, Technical Digest, IEEE Int. Electron Devices Meeting, San Francisco, California, Dec. 11-13, 2000, pp. 493-496.
Clark, John R., et al., Measurement Techniques For Capacitively-Transduced VHF-to-UHF Micromechanical Resonators, Digest of Technical Papers, the 11thInt. Conf. on Solid-State Sensors & Actuators, Munich, Germany, Jun. 10-14, 2001, pp. 1118-1121.
C. T. -C. Nguyen, “Micromachining technologies for miniaturized communication devices,” Proceedings of SPIE: Micromachining and Microfabrication, Sep. 20-22, 1998, pp. 24-38.
T. Hirano et al., “Design, Fabrication, and Operation of Submicron Gap Comb-Drive Microactuators,” Journal of Microelectromechanical Systems, Mar. 1992, No. 1, pp. 52-59.
J. R. Tucker et al., “Nanoscale FETs and STM Lithography,” University of Illinois, 1995, pp. 425-434.
C. T. -C. Nguyen, “High-Q Micromechanical Oscillators and Filters For Communications,” Int'l Symposium on Circuits and Systems, Jun. 9-12, 1997, pp. 2825-2828.
K. Tanaka, “Nanotechnology towards the 21stCentury,” Thin Solid Films, 1999, pp. 120-125.
Clark John R.
Hsu Wan-Thai
Nguyen Clark T.-C.
Brooks & Kushman P.C.
The Regents of the University of Michigan
Tsai H. Jey
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