Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate
2011-03-01
2011-03-01
Nguyen, Tuyen (Department: 2832)
Inductor devices
Coil or coil turn supports or spacers
Printed circuit-type coil
Reexamination Certificate
active
07898379
ABSTRACT:
Methods and structures for constructing a magnetic core of a coupled inductor. The method provides for constructing N-phase coupled inductors as both single and scalable magnetic structures, where N is an integer greater than 1. The method additionally describes how such a construction of the magnetic core may enhance the benefits of using the scalable N-phase coupled inductor. The first and second magnetic cores may be formed into shapes that, when coupled together, may form a single scalable magnetic core. For example, the cores can be fashioned into shapes such as a U, an I, an H, a ring, a rectangle, and a comb, that cooperatively form the single magnetic core.
REFERENCES:
patent: 2212543 (1940-08-01), Jovy
patent: 3878495 (1975-04-01), Thomas
patent: 3988665 (1976-10-01), Neumaier et al.
patent: 4455545 (1984-06-01), Shelly
patent: 4488136 (1984-12-01), Hansen et al.
patent: 4531085 (1985-07-01), Mesenhimer
patent: 4636752 (1987-01-01), Saito
patent: 4777406 (1988-10-01), Ross et al.
patent: 4800479 (1989-01-01), Bupp
patent: 5003277 (1991-03-01), Sokai et al.
patent: 5123989 (1992-06-01), Horiishi et al.
patent: 5161098 (1992-11-01), Balakrishnan
patent: 5177460 (1993-01-01), Dhyanchand et al.
patent: 5182535 (1993-01-01), Dhyanchand
patent: 5204809 (1993-04-01), Andresen
patent: 5225971 (1993-07-01), Spreen
patent: 5436818 (1995-07-01), Barthold
patent: 5469334 (1995-11-01), Balakrishnan
patent: 5565837 (1996-10-01), Godek et al.
patent: 5568111 (1996-10-01), Metsler
patent: 5574420 (1996-11-01), Roy et al.
patent: 5594402 (1997-01-01), Kritchafovitch et al.
patent: 5631822 (1997-05-01), Silberkleit et al.
patent: 5764500 (1998-06-01), Matos
patent: 5939966 (1999-08-01), Shin'Ei
patent: 6018468 (2000-01-01), Archer et al.
patent: 6060977 (2000-05-01), Yamamoto et al.
patent: 6342778 (2002-01-01), Catalano et al.
patent: 6348848 (2002-02-01), Herbert
patent: 6356179 (2002-03-01), Yamada
patent: 6362986 (2002-03-01), Schultz et al.
patent: 6377155 (2002-04-01), Allen et al.
patent: 6420953 (2002-07-01), Dadafshar
patent: 6549111 (2003-04-01), De Graaf et al.
patent: 6578253 (2003-06-01), Herbert
patent: 6714428 (2004-03-01), Huang et al.
patent: 6737951 (2004-05-01), Decristofaro et al.
patent: 6774758 (2004-08-01), Gokhale et al.
patent: 6784644 (2004-08-01), Xu et al.
patent: 6867678 (2005-03-01), Yang
patent: 6903648 (2005-06-01), Baumann et al.
patent: 6922883 (2005-08-01), Gokhale et al.
patent: 6965290 (2005-11-01), Gokhale et al.
patent: 7187263 (2007-03-01), Vinciarelli
patent: 7199695 (2007-04-01), Zhou et al.
patent: 7233132 (2007-06-01), Dong et al.
patent: 7248139 (2007-07-01), Podlisk et al.
patent: 7280025 (2007-10-01), Sano
patent: 7310039 (2007-12-01), Zhang
patent: 7352269 (2008-04-01), Li et al.
patent: 7498920 (2009-03-01), Sullivan et al.
patent: 7525408 (2009-04-01), Li et al.
patent: 2004/0017276 (2004-01-01), Chen
patent: 2004/0085173 (2004-05-01), Decristofaro et al.
patent: 2005/0024179 (2005-02-01), Chandrasekaran et al.
patent: 2006/0158297 (2006-07-01), Sutardja
patent: 2006/0197510 (2006-09-01), Chandrasekaran
patent: 2007/0175701 (2007-08-01), Xu et al.
patent: 2007/0176726 (2007-08-01), Xu et al.
patent: 2008/0205098 (2008-08-01), Xu et al.
patent: 922 423 (1955-01-01), None
patent: 26 53 568 (1978-06-01), None
patent: 3123006 (1983-01-01), None
patent: 37 03 561 (1988-08-01), None
patent: 10 105 087 (2001-08-01), None
patent: 10 2006 034553 (2007-06-01), None
patent: 0 012 629 (1980-06-01), None
patent: 0 225 830 (1987-06-01), None
patent: 0 577 334 (1994-01-01), None
patent: 1 519 392 (2005-03-01), None
patent: 1 519 473 (2005-03-01), None
patent: 1 835 604 (2007-09-01), None
patent: 60-015908 (1985-01-01), None
patent: 11 144983 (1999-05-01), None
patent: 11 307369 (1999-11-01), None
patent: 2002057049 (2002-02-01), None
patent: WO 2006/109329 (2006-10-01), None
U.S. Appl. No. 11/852,216, Response to Restriction Requirement filed Nov. 17, 2009, 3 pages.
U.S. Appl. No. 12/202,929, Notice of Allowance mailed Dec. 24, 2009, 8 pages.
U.S. Appl. No. 12/271,497, Non-final Rejection mailed Dec. 14, 2009, 7 pages.
U.S. Appl. No. 12/344,163, Restriction Requirement mailed Dec. 11, 2009, 6 pages.
U.S. Appl. No. 12/344,163, Response to Restriction Requirement filed Jan. 11, 2010, 4 pages.
Dong et al., Twisted Core Coupled Inductors for Microprocessor Voltage Regulators, Power Electronics Specialists Conference, pp. 2386-2392, Jun. 17-21, 2007.
Dong et al., The Short Winding Path Coupled Inductor Voltage Regulators, Applied Power Electronics Conference and Exposition, pp. 1446-1452, Feb. 24-28, 2008.
Dong et al., Evaluation of Coupled Inductor Voltage Regulators, Applied Power Electronics Conference and Exposition, pp. 831-837, Feb. 24-28, 2008.
Vishay, Low Profile, High Current IHLP Inductor, 3 pages, Jan. 21, 2009.
Panasonic, Power Choke Coil, 2 pages, Jan. 2008.
Cooper Bussmann, “Product Data Sheet for Low Profile Inductor (Surface Mount)” retreived from http://www.angliac.com, May 2003.
Papers received from Santangelo Law Office dated Dec. 22, 2006 and May 30, 2007.
Pulse, SMT Power Inductors datasheet, 2 pages, Nov. 2007.
Pulse, SMT Power Inductors Power Beads--PA0766NL Series; pp. 53-55; (date unknown).
Vitec, Dual High Frequency High Power Inductor, AF4390A data sheet; date unknown.
Wong, Pit-Leong, et al., “Investigating Coupling Inductors in the Interleaving QSW VRM” Applied Power Electronics Conference and Exposition, 2000. APEC 2000. Fifteenth Annual IEEE; Mar. 2000; pp. 973-978.
Wong, Pit-Leong, et al.; A Novel Modeling Concept for Multi-coupling Core Structures; Center for Power Electronics Systems; IEEE.
Wong, Pit-Leong, et al.; Performance Improvements of Interleaving VRMs With Coupling Inductors, IEEE Transactions on Power Electronics; vol. 16, No. 4; pp. 499-507; Jul. 2001.
Xu, J., et al; Analysis by Finite Element Method of a Coupled Inductor Circuit Used as Current Injection Interface; IEEE; pp. 147-151; 1996.
U.S. Appl. No. 11/929,827, Restriction Requirement mailed Aug. 18, 2008, 7 pages.
U.S. Appl. No. 11/929,827, Response to Restriction Requirement filed Sep. 4, 2008, 3 pages.
U.S. Appl. No. 11/929,827, Notice of Allowance mailed Oct. 21, 2008, 7 pages.
U.S. Appl. No. 11/929,827, Issue Fee Payment and Comments on Statement of Reasons for Allowance, Jan. 21, 2009, 2 pages.
U.S. Appl. No. 11/852,207, Restriction Requirement mailed Feb. 26, 2008, 7 pages.
U.S. Appl. No. 11/852,207, Response to Restriction Requirement filed Mar. 26, 2008, 3 pages.
U.S. Appl. No. 11/852,207, Office Action mailed Jun. 20, 2008, 7 pages.
U.S. Appl. No. 11/852,207, Notice of Abandonment mailed Dec. 23, 2008, 2 pages.
U.S. Appl. No. 10/318,896, Issue Fee Payment, Jan. 4, 2008, 1 page.
U.S. Appl. No. 10/318,896, Supplemental Notice of Allowance, Dec. 13, 2007, 2 pages.
U.S. Appl. No. 10/318,896; Notice of Allowance, Oct. 4, 2007, 4 pages.
U.S. Appl. No. 10/318,896, Sixth Request for Acknowledgement of an Information Disclosure Statement, Jan. 4, 2008, 6 pages.
U.S. Appl. No. 10/318,896; Statement of the Substance of Interview, Sep. 27, 2007, 2 pages.
U.S. Appl. No. 10/318,896, Supplemental Amendment filed Sep. 14, 2007, 12 pages.
U.S. Appl. No. 10/318,896, Response to Office Action mailed Jan. 18, 2007 and RCE; filed Jul. 18, 2007, 46 pages.
U.S. Appl. No. 10/318,896, Statement of the Substance of Interview; filed Apr. 23, 2007, 2 pages.
U.S. Appl. No. 10/318,896, Office Action mailed Jan. 18, 2007, 8 pages.
U.S. Appl. No. 10/318,896, Petition to Review Restriction Requirement, filed Aug. 24, 2006, 89 pages.
U.S. Appl. No. 10/318,896, Response to Office Action mailed Jun. 30, 2006; filed Oct. 25, 2006, 26 pages.
U.S. Appl. No. 10/318,896, Office Action mailed Jun. 30, 2006, 6 pages.
U.S. Appl. No. 10/318,896, Response to Office Action mailed Dec. 2, 2005; filed Mar. 24, 2006, 23 pages.
U.S. Appl. No. 10/318,896, Office Action mailed Dec. 2, 2005, 7 pages.
U.S. Appl. No. 10/318,896, Response to Office Action mailed Jun. 14, 2005; filed Sep. 14, 2005, 30 pages.
U.S. Appl. No. 10/318,896, Office Action mailed Jun. 14, 2005, 9 pa
Li Jieli
Stratakos Anthony
Sullivan Charles R.
Lathrop & Gage LLP
Nguyen Tuyen
Volterra Semiconductor Corporation
LandOfFree
Method for making magnetic components with N-phase coupling,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for making magnetic components with N-phase coupling,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making magnetic components with N-phase coupling,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2773593