Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2009-06-10
2010-06-08
Malsawma, Lex (Department: 2892)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S026000, C438S637000, C257SE21506
Reexamination Certificate
active
07732233
ABSTRACT:
The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer.
REFERENCES:
patent: 3942245 (1976-03-01), Jackson
patent: 5024966 (1991-06-01), Dietrich
patent: 5647122 (1997-07-01), Launay
patent: 6126276 (2000-10-01), Davis
patent: 6282094 (2001-08-01), Lo
patent: 6531328 (2003-03-01), Chen
patent: 6599768 (2003-07-01), Chen
patent: 6600231 (2003-07-01), Tominaga
patent: 6861284 (2005-03-01), Higashi
patent: 6970612 (2005-11-01), Ouchi
patent: 7022553 (2006-04-01), Ahn
patent: 7326907 (2008-02-01), Shibayama
patent: 2002/0163006 (2002-11-01), Yoganandan et al.
patent: 2002/0171090 (2002-11-01), Oohata et al.
patent: 2004/0065894 (2004-04-01), Hashimoto et al.
patent: 2005/0029535 (2005-02-01), Mazzochette
patent: 2006/0040417 (2006-02-01), Eldridge
patent: 2006/0076571 (2006-04-01), Hsieh
patent: 2006/0124953 (2006-06-01), Negley
patent: 2006/0208271 (2006-09-01), Kim
patent: 2007/0238328 (2007-10-01), Ferstl
patent: 2008/0179602 (2008-07-01), Negley et al.
patent: 2008/0179613 (2008-07-01), Wendt
patent: 2004105142 (2004-12-01), None
Huang Kuan-Jui
Kung Yen-Ting
Lin Hung-Yi
Tien She-Fen
Hsu Winston
Huber Robert
Malsawma Lex
Touch Micro-System Technology Corp.
LandOfFree
Method for making light emitting diode chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for making light emitting diode chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making light emitting diode chip package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4192492