Method for making integrated circuits

Details Method for making integrated circuits Method for making integrated circuits

1990-01-25

1991-05-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 48, 437187, 437206, 357 45, H01L 2144

Patent

active

050156004

ABSTRACT:
In a method for making integrated circuits, a semiconductor substrate is provided which carries a plurality of unconnected devices of a first device type at regularly spaced regions of the substrate and a plurality of unconnected devices of a secound, distinct device type at substantially all regions of the substrate other than those carrying devices of the first device type, and at least one interconnection layer is formed on the substrate to interconnect selected ones of the devices of the first device type and the devices of the second device type to define a plurality of integrated circuits. Pad regions may be formed over unconnected devices for connection of the integrated circuits to package terminals. The integrated circuits are separated by regions containing unconnected devices, and the semiconductor substrate may be scribed and broken or otherwise cut in these regions to separate the integrated circuits.

REFERENCES:
patent: 3835530 (1974-09-01), Kilby
patent: 4309811 (1982-01-01), Calhoun
patent: 4786613 (1988-11-01), Gould et al.

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