Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1995-02-24
1998-05-12
Niebling, John
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438123, 438124, 438126, 438127, H01L 2144
Patent
active
057504229
ABSTRACT:
An intergrated circuit package with plastic or glass reinforcement of leads to increase lead rigidity, to improve lead alignment and positional stability, and to prevent bent leads. The invention is particularly applicable to surface mount packages. For plastic packages, plastic between the leads is formed during molding of the plastic package. For metal packages, the plastic is molded as a separate operation. For ceramic packages with lead frames, glass may be formed as a separate operation or may be formed at the same time as a glass seal for the ceramic package. Reinforcement can optionally be thicker than the leads for increased rigidity. Optional extended lead lengths enable plastic or glass to be formed on either side of the soldered foot area of each lead. No changes to test fixtures or to pick and place equipment are required.
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Bradley Havyn Eugene
Butler Richard M.
Mills Louis Thomas
Hewlett--Packard Company
Niebling John
Pham Long
Winfield Augustus W.
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