Method for making ink jet printheads

Details Method for making ink jet printheads Method for making ink jet printheads

2005-02-08

2005-02-08

Mills, Gregory (Department: 1763)

Etching a substrate: processes

Forming or treating thermal ink jet article

C029S890100

Reexamination Certificate

active

06852241

ABSTRACT:
The invention provides an improved method for grit blasting slots in a silicon wafer. The method includes, providing a silicon wafer having a first surface and a second surface, the first surface containing resistive, conductive and insulative layers defining individual semiconductor components, applying a first substantially permanent non-water soluble layer selected from silane, photoresist materials and a combination of a silane layer and a photoresist layer to the first surface of the wafer to provide a first substantially permanent layer thereon, applying a water-soluble protective material to the first layer to provide a second layer, grit blasting slots in the wafer corresponding to the individual semiconductor components, and subsequently, removing the water-soluble protective layer from the wafer. The protective layer provides enhanced protection for the electrical components on a silicon wafer during a grit blasting process so that a higher yield of useable semiconductor chips may be made.

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