Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2008-09-16
2008-09-16
Chen, Bret (Department: 1792)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S097200, C427S097400, C427S255600, C438S763000, C438S778000, C438S780000
Reexamination Certificate
active
10936156
ABSTRACT:
A method of forming a hybrid inorganic/organic dielectric layer on a substrate for use in an integrated circuit is provided, wherein the method includes forming a first dielectric layer on the substrate via chemical vapor deposition, and forming a second dielectric layer on the first dielectric layer via chemical vapor deposition, wherein one of the first dielectric layer and the second dielectric layer is formed from an organic dielectric material, and wherein the other of the first dielectric layer and the second dielectric layer is formed from an inorganic dielectric material.
REFERENCES:
patent: 6068884 (2000-05-01), Rose et al.
patent: 6255735 (2001-07-01), Wang et al.
patent: 6287961 (2001-09-01), Liu et al.
patent: 6383919 (2002-05-01), Wang et al.
patent: 6391757 (2002-05-01), Huang et al.
patent: 6486557 (2002-11-01), Davis et al.
patent: 6603204 (2003-08-01), Gates et al.
patent: 6677680 (2004-01-01), Gates et al.
patent: 6743713 (2004-06-01), Mukherjee-Roy et al.
patent: 6965169 (2005-11-01), Lu et al.
patent: 2007/0001306 (2007-01-01), Su et al.
patent: WO/2004/044978 (2004-05-01), None
Han, K., et al., “Stable and robust low-voltage pentacene transistor based on a hybrid dielectric”. Microelectronic Engineering, vol. 84, Issues 9-10, Sep./Oct. 2007, pp. 2173-2176.
Chen Chieh
Kumar Atul
Lee Chung J.
Pikovsky Yuri
Allerman Hall McCoy Russell & Tuttle LLP
Chen Bret
Dielectric Systems Inc.
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