Method for making hollow pendants

Chemistry: electrical and wave energy – Processes and products

Patent

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Details

204 29, C25D 534, C25D 700

Patent

active

044191936

ABSTRACT:
A method for making hollow pendants of copper plate without any holes therein so that electrolyte does not flow into the hollow of the pendants during electroplating. These hollow pendants can hold their beautiful surface a long time without being corroded by electrolyte solvent flowing into and slowly seeping out of the hollow parts of a pendant. Copper plate is cut and press-formed into half-pieces, two half-pieces are clamped together and welded tightly with silver, the hollow product undergoes grinding and polishing and is finally electroplated to complete the finished product with no holes. Consequently, its brilliant surface can not be spoiled by electrolyte solvent seeping out of any tiny holes.

REFERENCES:
patent: 3453185 (1969-07-01), Nakagawa
patent: 3886051 (1975-05-01), Albright

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