Method for making flip chip on leadframe package

Details Method for making flip chip on leadframe package Method for making flip chip on leadframe package

2006-12-12

2008-09-16

Lee, Hsien Ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S613000

Reexamination Certificate

active

07425468

ABSTRACT:
A flip chip on leadframe package and manufacturing method includes providing a leadframe having a plurality of inner leads; providing a chip having an active surface; forming a plurality of first bumps and at least one second bump on the active surface, the material of the first bumps is the same as the second bump, and the height of the second bump is lower than the first bumps; dipping the top of the first bumps in a flux, so that the second bump is not dipped with the flux; contacting the first bumps to the corresponding inner leads; proceeding with a reflow so that the first bumps are melted and connected to the corresponding inner leads, and the second bump is connected to the corresponding inner lead without being melted, to maintain a gap between the chip and the inner leads to prevent collapse of the first bumps.

REFERENCES:
patent: 5612573 (1997-03-01), Lewis et al.
patent: 6175157 (2001-01-01), Morifuji
patent: 6429113 (2002-08-01), Lewis et al.
patent: 6798667 (2004-09-01), Chan
patent: 2001/0008310 (2001-07-01), Sakuyama et al.
patent: 2001/0019173 (2001-09-01), Taguchi et al.
patent: 2004/0124540 (2004-07-01), Chen et al.
patent: 2005/0233571 (2005-10-01), Tao et al.
patent: 2006/0068521 (2006-03-01), Shi et al.
patent: 2006/0076679 (2006-04-01), Batchelor et al.
patent: 2007/0035019 (2007-02-01), Carney et al.
patent: I236110 (2005-07-01), None

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