Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate
2008-06-03
2008-06-03
Feely, Michael J (Department: 1796)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
C257S787000, C257S789000, C257S793000, C264S272130, C264S272170, C428S413000, C438S127000, C523S427000, C523S440000, C523S443000, C523S444000, C523S445000, C525S523000, C525S524000, C525S525000, C525S526000
Reexamination Certificate
active
07381359
ABSTRACT:
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
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Meixner D. Laurence
Meyers Douglas
Morris Mark
Raychaudhuri Satyabrata
Yan Yongan
Feely Michael J
Sheppard Mullin Richter & Hampton LLP
Yazaki -Corporation
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