Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed
Patent
1999-08-30
2000-11-14
Nelms, David
Semiconductor device manufacturing: process
With measuring or testing
Optical characteristic sensed
438216, 438303, 438672, 438696, 257310, 257355, 257410, 257411, G01R 3126
Patent
active
061469130
ABSTRACT:
This invention is predicated on applicant's discovery that near the gate dielectric/semiconductor interface, surface roughness of a particular spectral range plays a disproportionately larger role in scattering electrons and impeding their transport. Moving electrons will not enter the nooks and crannies of roughness having wavelength shorter than about 100 .ANG. and therefore are not affected by them, and electrons are less affected by roughness having wavelengths longer than about 1000 .ANG.. Accordingly, it is desirable to reduce the surface roughness of gate dielectrics at the interface. This can be accomplished prior to dielectric formation by inspection of semiconductor wafers for surface roughness and rejection of those wafers with high surface roughness content in the range 100 .ANG. to 1000 .ANG.. Such inspection also provides a valuable criterion for selecting optimum semiconductor processing steps.
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Dang Phuc T.
Lucent Technologies - Inc.
Nelms David
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