Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-01-17
2006-01-17
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
Reexamination Certificate
active
06987033
ABSTRACT:
A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
REFERENCES:
patent: 3540957 (1970-11-01), Bawa
patent: 3783218 (1974-01-01), Adams et al.
patent: 4295115 (1981-10-01), Takahashi et al.
patent: 4452624 (1984-06-01), Wohltjen et al.
patent: 4481497 (1984-11-01), Kurtz et al.
patent: 4638552 (1987-01-01), Shimbo et al.
patent: 5396042 (1995-03-01), Ishida et al.
patent: 5406108 (1995-04-01), Inada
patent: 5411919 (1995-05-01), Inada
patent: 5443890 (1995-08-01), Ohman
patent: 5493305 (1996-02-01), Wooldridge et al.
patent: 5591679 (1997-01-01), Jakobsen et al.
patent: 5600541 (1997-02-01), Bone et al.
patent: 5611876 (1997-03-01), Newton et al.
patent: 5621837 (1997-04-01), Yamada et al.
patent: 5672826 (1997-09-01), Suzuki et al.
patent: 5755942 (1998-05-01), Zanzucchi et al.
patent: 5814883 (1998-09-01), Sawai et al.
patent: 5820648 (1998-10-01), Akaike et al.
patent: 5866469 (1999-02-01), Hays
patent: 5892279 (1999-04-01), Nguyen
patent: 6013562 (2000-01-01), Kemmer
patent: 6091146 (2000-07-01), Berkely et al.
patent: 6377461 (2002-04-01), Ozman et al.
patent: 6462410 (2002-10-01), Novotny et al.
patent: 01/29890 (2001-04-01), None
Gamlen Carol
Newton Charles M.
O'Dowd Betty
Pike Randy T.
Rumpf Raymond C.
Allen Dyer Doppelt Milbrath & Gilchrist, P.A.
Harris Corporation
Zarneke David A.
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