Method for making dual gauge leadframe

Details Method for making dual gauge leadframe Method for making dual gauge leadframe

2006-04-25

2006-04-25

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C257S666000, C257S676000

Reexamination Certificate

active

07033866

ABSTRACT:
A leadframe (20) for a semiconductor device includes a first leadframe portion (12) having a perimeter that defines a cavity (16) and a plurality of leads (14) extending inwardly from the perimeter and a first thickness. A second leadframe portion (18) is attached to the first leadframe portion (16). The second leadframe portion (18) has a die paddle (20) received within the cavity (16) of the first leadframe portion (12). The second leadframe portion (18) has a second thickness that is greater than a thickness of the first leadframe portion (12). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.

REFERENCES:
patent: 5557842 (1996-09-01), Bailey

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