Semiconductor device manufacturing: process – Making passive device – Trench capacitor
Patent
1998-08-19
2000-08-29
Bowers, Charles
Semiconductor device manufacturing: process
Making passive device
Trench capacitor
H01L 2120
Patent
active
061107921
ABSTRACT:
A method of forming a trench capacitor comprises steps of forming a trench in a substrate, partially filling the trench with a first conductive material, lining a portion of the trench above the first conductive material with a collar material, etching the collar material to a strap depth below a top of the trench, and filling the trench with a second conductive material, wherein a portion of the second conductive material positioned between the strap depth and the top of the trench comprises a buried strap.
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Kenney, "Spacer-Defined Strap", IBM Technical Disclosure Bulletin, vol. 32, No. 4B, Sep. 1989, pp. 321-322.
Bronner Gary B.
Radens Carl J.
Wittmann Juergen
Bowers Charles
International Business Machines - Corporation
Neff, Esq. Daryl K.
Siemens Microelectronics, Inc.
Thompson Craig
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