Method for making direct chip attach circuit card

Details Method for making direct chip attach circuit card Method for making direct chip attach circuit card

1995-06-07

1997-06-03

Schwartz, Larry I.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 22818022, H05K 334

Patent

active

056342683

ABSTRACT:
A structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is made using an organic or an inorganic laminated carrier having at least one surface available for direct chip mount. The chip has at least one solder ball with a cap of low melting point metal. The surface of the carrier has electrical features that are directly connected to the low melting point metal on the solder ball of the chip to form the eutectic and this way the chip is directly attached to the carrier.

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Microelectronics Packaging Handbook, edited by Rao R. Tummala & Eugene J. Rymaszewski, SR28-4413-00, pp. 366-391.

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