Etching a substrate: processes – Forming or treating a sign or material useful in a sign – Sign or material is electroluminescent
Patent
1995-09-15
1998-01-27
Breneman, R. Bruce
Etching a substrate: processes
Forming or treating a sign or material useful in a sign
Sign or material is electroluminescent
216 25, 216 39, 216 40, F21P 502, G02B 528
Patent
active
057118892
ABSTRACT:
A dichroic filter array is mounted on a wafer by combining microelectronic and microlithography techniques. A release layer of copper is evaporated onto a wafer, and the release layer is coated with a photoresist. The assembly is masked, and the unmasked photoresist, after exposure to ultraviolet light, is developed to expose a predetermined section of the release layer. That section of release layer is then overetched to create an undercut in its walls and to expose the underlying wafer. Dichroic filter material is then deposited onto the wafer by a cold process, and the release layer is then removed, leaving only the dichroic filter material on the wafer. The process is repeated to create an array.
REFERENCES:
patent: 3839039 (1974-10-01), Suzuki et al.
patent: 3914464 (1975-10-01), Thomasson et al.
patent: 4182647 (1980-01-01), Yoshihara et al.
patent: 5217832 (1993-06-01), Joslin et al.
Breneman R. Bruce
Foutch Louise A.
Goudreau George
Mason, Jr. Joseph C.
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