Method for making dichroic filter array

Etching a substrate: processes – Forming or treating a sign or material useful in a sign – Sign or material is electroluminescent

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216 25, 216 39, 216 40, F21P 502, G02B 528

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active

057118892

ABSTRACT:
A dichroic filter array is mounted on a wafer by combining microelectronic and microlithography techniques. A release layer of copper is evaporated onto a wafer, and the release layer is coated with a photoresist. The assembly is masked, and the unmasked photoresist, after exposure to ultraviolet light, is developed to expose a predetermined section of the release layer. That section of release layer is then overetched to create an undercut in its walls and to expose the underlying wafer. Dichroic filter material is then deposited onto the wafer by a cold process, and the release layer is then removed, leaving only the dichroic filter material on the wafer. The process is repeated to create an array.

REFERENCES:
patent: 3839039 (1974-10-01), Suzuki et al.
patent: 3914464 (1975-10-01), Thomasson et al.
patent: 4182647 (1980-01-01), Yoshihara et al.
patent: 5217832 (1993-06-01), Joslin et al.

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