Method for making device for high resolution electron beam fabri

Details Method for making device for high resolution electron beam fabri Method for making device for high resolution electron beam fabri

1975-02-26

1976-07-27

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29576R, 96 362, 156 13, 156 17, B05D 306

Patent

active

039718603

ABSTRACT:
The disclosed method is one which provides an extremely thin substrate upon which there can be laid down a high resolution pattern of material such as metal by an electron beam fabrication technique. The latter technique is one wherein a resist is placed on the surface of the substrate. Thereafter, an electron beam is utilized to expose the resist in the desired pattern. The exposed resist is then removed and the metal or other material is laid down on the locations where the resist has been removed. With the use of the very thin substrate, the amount and effect of electron backscattering is substantially minimized whereby the consequent decrease of resolution due to exposure of the resist with the backscattered electrons is effectively eliminated. Accordingly, the resist exposure can be confined to much narrower widths than heretofore possible with known electron beam fabrication techniques.

REFERENCES:
patent: 3239374 (1966-03-01), Ames et al.
patent: 3437533 (1969-04-01), Dingwall
patent: 3455020 (1969-07-01), Dawson et al.
patent: 3486892 (1969-12-01), Rosvold
patent: 3535137 (1970-10-01), Haller et al.
patent: 3537921 (1970-11-01), Boland
patent: 3709749 (1973-01-01), Sato et al.
patent: 3725160 (1973-04-01), Bean et al.
patent: 3761782 (1973-09-01), Youmans

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