Method for making cusp-free anti-fuse structures

Details Method for making cusp-free anti-fuse structures Method for making cusp-free anti-fuse structures

1993-01-29

1994-07-12

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437228, 437192, 437922, H01L 2170, H01L 2700

Patent

active

053288653

ABSTRACT:
A method for making an anti-fuse structure characterized by the steps of forming a conductive base layer; forming an anti-fuse layer over the base layer; patterning the anti-fuse layer to form an anti-fuse island; forming an insulating layer over the anti-fuse island; forming a via hole through the insulating layer to the anti-fuse island; forming a conductive connection layer over the insulating layer and within the via hole; and patterning the conductive connection layer to form a conductive contact to the anti-fuse island. Preferably, the anti-fuse island comprises amorphous silicon which can optionally be covered with a thin layer of a titanium-tungsten alloy.

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