Method for making curable coatings

Details Method for making curable coatings Method for making curable coatings

1996-02-26

1997-03-04

Beck, Shrive

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

427515, 427518, 427519, 427520, 522 77, 522 83, 522 99, 524301, 524394, 524777, 528 14, B05D 306

Patent

active

056077297

ABSTRACT:
A gel-free silica acrylate curable coating composition made from one or more of soluble salts, soaps, amines, nonionic and anion surfactants, acids or mixtures thereof, and a method for producing these compositions.

REFERENCES:
patent: 2597614 (1952-05-01), Brown et al.
patent: 3258477 (1966-06-01), Plueddemann et al.
patent: 3816267 (1974-06-01), Chuang
patent: 3865588 (1975-02-01), Ohto et al.
patent: 4021310 (1977-05-01), Shimizu et al.
patent: 4027073 (1977-05-01), Clark
patent: 4201808 (1980-05-01), Cully et al.
patent: 4348462 (1982-09-01), Chung
patent: 4403058 (1983-09-01), Dohi et al.
patent: 4455205 (1984-06-01), Olson et al.
patent: 4478876 (1984-10-01), Chung
patent: 4486504 (1984-12-01), Chung
patent: 4491508 (1985-01-01), Olson et al.
patent: 4644077 (1987-02-01), Gupta
patent: 4709067 (1987-11-01), Chu et al.
patent: 4831093 (1989-05-01), Swarts
patent: 4877654 (1989-10-01), Wilson
patent: 4973612 (1990-11-01), Cottington et al.
patent: 5103032 (1992-04-01), Turner et al.
patent: 5120811 (1992-06-01), Gotfelter et al.
patent: 5214085 (1993-05-01), Patel et al.
patent: 5232964 (1993-08-01), Evans et al.
patent: 5242719 (1993-09-01), Medford et al.
patent: 5318850 (1994-06-01), Pickett et al.

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