Chemistry: electrical and wave energy – Processes and products
Patent
1976-03-01
1978-02-14
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204208, C25D 104, C25D 120, C25D 122
Patent
active
040736997
ABSTRACT:
The improved method of the invention includes depositing, as by electroplating, a coating of porefree copper on a clean fresh plateable layer, such as selected metal oxide, on a surface of a flexible elongated metal strip or belt to form copper foil, stripping the foil from the layer, removing the layer from the belt and reforming it, as by electro-deposition or the like, as a fresh clean layer ready to receive a copper coating as above. The steps of the method are performed in separate treating zones and the method can be continuous.
At least certain of the major treating zones preferably are in duplicate so as to facilitate maintenance thereof without interrupting the continuous production of the copper foil. In one embodiment the copper foil, before it is stripped from the plateable layer, is treated to increase its bondability to plastics. Such bondability is also increased in a separate embodiment by mechanically or chemically roughening a surface of the belt before the plateable layer is formed or reformed thereon. The plateable layer and the copper foil are then deposited on the roughened surface and follow its contours. The roughened surface can also finely control the extent of adhesion between the plateable layer and copper foil.
Apparatus of the invention for carrying out the present method includes a plurality of the described zones, the described layer and belt, and transport means for passing the belt sequentially through the zones. Preferably, the equipment is in large part redundant so that maintenance and repairs can be conducted on a part thereof without interfering with the operation of the present equipment in a continuous mode. Inexpensive high quality copper foil laminates useful in manufacturing electrical and electronic circuitry and the like are provided by the method and apparatus.
REFERENCES:
patent: 880484 (1908-02-01), Edison
patent: 1760028 (1930-05-01), Williams et al.
patent: 2433441 (1947-12-01), Davidoff
patent: 3151048 (1964-09-01), Conley et al.
patent: 3398442 (1968-08-01), Palmer
patent: 3990926 (1976-11-01), Konicek
patent: 3998601 (1976-12-01), Yates et al.
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