Method for making cooling structures for directly cooling an act

Details Method for making cooling structures for directly cooling an act Method for making cooling structures for directly cooling an act

1993-08-09

1994-12-27

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437248, 437902, H01L 2160

Patent

active

053765877

ABSTRACT:
Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink are disclosed. The inventive cooling structure consists of a current/voltage supply level, with metal structures and insulation spacers and/or layers, partly covered by an insulation layer and followed by a heat transfer structure. A heat transfer bridge is in thermal connection with the heat transfer structure that provides for heat flux between the inventive cooling structure and the heat sink. The inventive cooling structure of this invention can be used with semiconductor devices and/or with opto-electronic devices.

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IBM Technical Disclosure Bulletin, vol. 20, No. 5, p. 1768, Oct. 1977, E. E. Zirnis, "Semiconductor Module with Improved Air Cooling".
IBM Technical Disclosure Bulletin, vol. 20, No. 8, p. 3223, Jan. 1978, O. R. Gupta, "Chip/Can Conducting Path".
IBM Technical Disclosure Bulletin, vol. 27, No. 7B, pp. 4413-4415, Dec. 1984, W. C. Yeh, "Bump Internal-Thermal Enhancement".
"Microelectronics Packaging Handbook", copyright 1989 Van Nostrand Reinhold, pp. 48-49 and 338, R. R. Tummala and E. J. Rymaszewski.

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